Packaging device for holding a plurality of semiconductor devices to be inspected

ABSTRACT

A packaging device for holding thereon a plurality of semiconductor devices to be inspected on an inspection device including a probe to be electrically connected to an electrode of each of the semiconductor devices, comprises, holes for respectively receiving detachably therein the semiconductor devices to keep a positional relationship among the semiconductor devices and a positional relationship between the packaging device and each of the semiconductor devices constant with a spacing between the semiconductor devices, in a direction perpendicular to a thickness direction of the semiconductor devices, and electrically conductive members adapted to be connected respectively to the electrodes of the semiconductor devices, and extending to an exterior of the packaging device so that the probe is connected to each of the electrically conductive members.

BACKGROUND OF THE INVENTION AND RELATED ART STATEMENT

[0001] The present invention relates to a method for producingsemiconductor devices, and to a packaging device usable in such amethod.

[0002] JP-A-3-131048 discloses a burn-in test method in whichsemiconductor chips are mounted directly on a substrate to be tested onthe substrate.

[0003] JP-63-204621 discloses an aging test device in which wafers, eachincluding thereon semiconductor chips thereon, are mounted on acontainer plate to be tested on the container plate by a probe body.

OBJECT AND SUMMARY OF THE INVENTION

[0004] An object of the present invention is to provide a method forproducing semiconductor devices, and to provide a packaging deviceusable in the method, whereby each of the semiconductor devices iseasily and securely inspected.

[0005] According to the present invention, a method for producingsemiconductor devices comprises the steps of:

[0006] forming electric circuits on a semiconductor wafer,

[0007] cutting off the semiconductor wafer to be divided into thesemiconductor devices respectively including the electric circuits sothat the semiconductor devices are separated away from each other,

[0008] mounting a plurality of the semiconductor devices onto apackaging device for keeping a positional relationship among thesemiconductor devices, and keeping a positional relationship between thepackaging device and each of the semiconductor devices constant with aspacing between the semiconductor devices on the packaging device,

[0009] transferring the packaging device, holding thereon the pluralityof the semiconductor devices onto an inspection device so that each ofthe semiconductor devices on the packaging device is inspected on theinspection device, while the positional relationship among thesemiconductor devices and the positional relationship between thepackaging device and each of the semiconductor devices are kept constanton the packaging device, and

[0010] removing the semiconductor devices from the packaging deviceafter each of the semiconductor devices on the packaging device isinspected on the inspection device, so that the semiconductor devicesare separated from each other in order to be useable independent of eachother.

[0011] Since, when the plurality of the discrete semiconductor devicesare transferred onto the inspection device and are inspected on theinspection device, the plurality of the discrete semiconductor devicesare held in the packaging device so that at least a part of theelectrode of each of the semiconductor devices is covered by thepackaging device to prevent said part of the electrode from facing to anenvironment surrounding the packaging device in the thickness directionof the semiconductor devices, the positional relationship among thediscrete semiconductor devices and the positional relationship betweenthe packaging device and each of the discrete semiconductor devices arekept constant with the spacing between the discrete semiconductordevices on the packaging device. Each of the discrete semiconductordevices is easily and securely inspected without interference betweenthe semiconductor devices and without any direct damage of either of thediscrete semiconductor devices from the environment surrounding thepackaging device.

[0012] At least one inspection for judging whether or not each of thesemiconductor devices is useable after either of a predeterminedtemperature and/or a predetermined voltage is applied to the each of thesemiconductor devices during a predetermined time period and. Inaddition, an inspection for judging whether or not each of thesemiconductor devices performs a predetermined operating characteristicin a predetermined environment condition may be carried out on theinspection device. The method may further comprise the step of selectingthe semiconductor devices to be mounted onto the packaging device fromthe semiconductor devices formed on the semiconductor wafer on the basisof a relationship between an electrical input and an electrical outputon each of the semiconductor devices. The selecting step may be carriedout after the semiconductor wafer is cut off to be divided into thesemiconductor devices or before the semiconductor wafer is cut off to bedivided into the semiconductor devices. The number of the semiconductordevices held on the packaging device when the packaging device istransferred onto the inspection device may be smaller than the number ofthe semiconductor devices formed on the semiconductor wafer.

[0013] If all of the semiconductor devices are pressed against thepackaging device by an elastic member while each of the semiconductordevices on the packaging device is inspected on the inspection device,the inspection of each of the semiconductor devices is stably carriedout while preventing interference between the semiconductor devices. Itis preferable for the stable inspection of each of the semiconductordevices that the direction in which all of the semiconductor devices arepressed against the packaging device by the elastic member is oppositeto the direction in which an electrically conductive member of thepackaging device is pressed against an electrode of the each of thesemiconductor devices on the packaging device, in a thickness directionof the semiconductor devices.

[0014] The packaging device may be pressed against the inspection devicewhile each of the semiconductor devices on the packaging device isinspected on the inspection device. It is preferable for the stableinspection of each of the semiconductor devices that the direction inwhich the packaging device is pressed against the inspection device isopposite to the direction in which the electrically conductive member ofthe packaging device is pressed against the electrode of each of thesemiconductor devices on the packaging device.

[0015] According to the present invention, a packaging device forholding thereon a plurality of semiconductor devices to be inspected onan inspection device, including a probe to be electrically connected toan electrode of each of the semiconductor devices, comprises,

[0016] holes for respectively receiving detachably therein thesemiconductor devices to keep a positional relationship among thesemiconductor devices and a positional relationship between thepackaging device and each of the semiconductor devices constant with aspacing between the semiconductor devices, in a direction perpendicularto the thickness direction of the semiconductor devices, or directionsperpendicular to each other and perpendicular to the thickness directionof the semiconductor devices, and

[0017] electrically conductive members adapted to be connectedrespectively to the electrodes of the semiconductor devices, andextending to an exterior of the packaging device so that the probe isconnected to each of the electrically conductive members.

[0018] Since the semiconductor devices are received respectively by theholes in order to keep the positional relationship among thesemiconductor devices and the positional relationship between thepackaging device and each of the semiconductor devices constant with thespacing between the semiconductor devices, in a direction perpendicularto the thickness direction of the semiconductor devices, or directionsperpendicular to each other and perpendicular to the thickness directionof the semiconductor devices, and the electrically conductive membersare connected respectively to the electrodes of the semiconductordevices when each of the semiconductor devices is inspected, and extendto an exterior of the packaging device so that the probe is connected toeach of the electrically conductive members, each of the discretesemiconductor devices is easily and securely inspected withoutinterference between the discrete semiconductor devices and without anydirect damage of any of the discrete semiconductor devices from theenvironment surrounding the packaging device.

[0019] The ends of the electrically conductive members exposed to theexterior of the packaging device may be more widely distributed over asurface of the packaging device in comparison with an arrangement of theelectrodes on the semiconductor devices.

[0020] If a main component (for example, Si) of a part of the packagingdevice surrounding the holes is equal to that (for example, Si) of thesemiconductor devices, a thermal stress between the holes and thesemiconductor devices is decreased, irrespective of any temperaturechange of the packaging device.

[0021] If an elastic member presses all of the semiconductor devicesagainst the packaging device in the thickness direction of thesemiconductor devices when each of the semiconductor devices on thepackaging device is inspected on the inspection device, the inspectionof each of the semiconductor devices is stably carried out whilepreventing interference between the semiconductor devices. It ispreferable for the stable inspection of each of the semiconductordevices that direction in which all of the semiconductor devices arepressed against the packaging device by the elastic member is oppositeto the direction in which the electrically conductive members arepressed against the semiconductor devices, in the thickness direction ofthe semiconductor devices, respectively. The probe and each of theelectrically conductive members may be elastically connected to eachother.

[0022] If the packaging device includes a first sheet for supporting thesemiconductor devices in the thickness direction of the semiconductordevices, a second sheet having the holes, and the first and secondsheets are stacked in the thickness direction of the semiconductordevices, and the electrically conductive members extend through thefirst sheet in the thickness direction of the semiconductor devices, acomplex structure of the packaging device can be easily and correctlyformed. If a main component of the second sheet (for example, Si) isequal to that of the semiconductor devices, a thermal stress between thesecond sheet and the semiconductor devices is decreased, irrespective ofany temperature change of the packaging device. The packaging device mayfurther comprise a third sheet which has through holes and covers thesecond sheet, wherein the first, second and third sheets are stacked inthe thickness direction of the semiconductor devices while the throughholes are aligned respectively with the holes in the thickness directionof the semiconductor devices. The opening areas of the through holes arelarger than those of the holes to prevent the semiconductor devices frombeing positioned respectively by the through holes, so that the secondsheet made with high-accuracy for correctly positioning thesemiconductor devices is wholly protected by the third sheet, while thethird sheet is prevented from deteriorating the positioning of thesemiconductor devices in the holes.

[0023] If the packaging device further comprises a support part on whichan end of each of the electrically conductive members is arranged,wherein the support part has a pair of projections between which the endof each of the electrically conductive members is arranged in thedirection perpendicular to the thickness direction of the semiconductordevices, and the end of each of the electrically conductive members andboth of the projections are adapted to contact with each of thesemiconductor devices, so that an area of the support part between theend of each of the electrically conductive members and each of theprojections is prevented from contacting with each of the semiconductordevices, an area of each of the semiconductor devices adjacent to theelectrode is prevented from being pressed by the support part while theelectrode and another area of the each of the semiconductor devices faraway from the electrode are pressed by the support member, and anattitude of the end of each of the electrically conductive membersrelative to each of the electrodes is correctly kept by the projectionsof the support part, both contacting with each of the semiconductordevices. Generally, the area of each of the semiconductor devices orchips adjacent to the electrode includes an easily-breakable electriccircuit.

[0024] If a clearance is formed between each of the holes and each ofthe semiconductor devices in both directions perpendicular to each otherand perpendicular to the thickness direction of the semiconductor deviceto prevent each of the semiconductor devices from being compressed ineach of the holes in both directions, irrespective of any temperaturechange in either the packaging device and/or any of the semiconductordevices when the each of the semiconductor devices is inspected on theinspection device, each of the semiconductor devices can be inspected ina stress-free condition in both directions even when a difference inexpansion or contraction between the packaging device and the each ofthe semiconductor devices is caused by the temperature change.

[0025] If at least a part of the electrode of each of the semiconductordevices is covered by the packaging device to prevent at least a part ofthe electrode of each of the semiconductor devices from facing anenvironment surrounding the packaging device in the thickness directionof the semiconductor devices, the part of the electrode of each of thesemiconductor devices is protected from being damaged by theenvironment.

[0026] If the packaging device comprises support parts on each of whichan end of each of the electrically conductive members is arranged, and apair of slits between which each of the support parts with the end isarranged in the direction perpendicular to the thickness direction ofthe semiconductor devices, a rigidity of the support part is decreasedeffectively, even when the size of the support part and the distancebetween the support parts are significantly small.

[0027] If an exposed area of an end of the each of electricallyconductive members adapted to face the each of the semiconductor devicesis smaller than an exposed area of another end of each of theelectrically conductive members on the exterior of the packaging device,as seen in the thickness direction of the semiconductor devices, anelectrical capacitance between the end of each of the electricallyconductive members facing each of the semiconductor devices and the eachof the electrodes contacting with the end of each of the electricallyconductive members is kept small, while the exposed area of another endof each of the electrically conductive members on the exterior of thepackaging device is sufficiently large for being easily and securelyconnected with the probe of the inspection device.

BRIEF DESCRIPTION OF THE DRAWINGS

[0028]FIG. 1 is a schematic oblique-projection view showing a packagingdevice of the invention mounted on an inspection device.

[0029]FIG. 2 is a flow chart carried out in a method of the invention.

[0030]FIG. 3 is a schematic oblique-projection view showing a wafer onwhich semiconductor devices are formed.

[0031]FIG. 4 is a schematic oblique-projection view showing an exampleof a semiconductor device to be produced by the method of the presentinvention or to be housed by the packaging device.

[0032]FIG. 5 is a schematic oblique-projection view showing elements ofthe packaging device.

[0033]FIG. 6 is a schematic oblique-projection view showing one of theelements for supporting the semiconductor devices in a thicknessdirection of the semiconductor devices with electrically conductivemembers therein for connecting each of the electrodes of thesemiconductor devices to a probe of the inspection device.

[0034]FIG. 7a is a schematic oblique-projection view showing a surfaceof one of the elements facing the semiconductor devices.

[0035]FIG. 7b is a schematic oblique-projection view showing a reversesurface of one of the elements facing the inspection device.

[0036]FIG. 8 is a schematic oblique-projection view showing thepackaging device of the invention onto which the semiconductor devicesare being mounted.

[0037]FIG. 9a is a schematic oblique-projection view showing a surfaceof the packaging device in which the semiconductor devices are setcompletely.

[0038]FIG. 9b is a schematic oblique-projection view showing a reversesurface of the packaging device of FIG. 9a.

[0039]FIG. 10a is a schematic oblique-projection view showing theinspection device before the packaging device is mounted thereon.

[0040]FIG. 10b is a schematic oblique-projection view showing theinspection device after the packaging device is mounted thereon.

[0041]FIG. 11 is a partially cross-sectional view 10 showing aconnection from the electrodes of the semiconductor devices to the probethrough the electrically conductive members.

[0042]FIG. 12 is a partially cross-sectional side view showing theprobes to be connected to the electrically conductive members.

[0043]FIG. 13 is a partially cross-sectional side view showing astructure of the packaging device for supporting an area adjacent toeach of the electrodes, while the electrodes contact respectively withthe electrically conductive members.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENT

[0044] Along with a flow chart shown in FIG. 2, in a method forproducing semiconductors, the following processes are carried out:

[0045] (1) preparation process (for example, forming electric circuitson a wafer),

[0046] (2) pre-inspection by probe,

[0047] (3) dicing the wafer to form semiconductor devices,

[0048] (4) mounting the semiconductor device into a packaging device,

[0049] (5) burn-in treatment,

[0050] (5-1) mounting the packaging device onto a burn-in device,

[0051] (5-2) performing the burn-in treatment,

[0052] (5-3) taking out the packaging device from the burn-in device,

[0053] (6) transferring the packaging device from the burn-in device toan operation inspection device,

[0054] (7) operation inspection,

[0055] (7-1) mounting the packaging device onto the operation inspectiondevice,

[0056] (7-2) performing operation inspection,

[0057] (7-3) taking out the packaging device from the operationinspection device,

[0058] (8) taking out the semiconductor device from the packagingdevice.

[0059] (1) Preparation Process

[0060] The semiconductor devices (for example, LSI circuits) 1 b areformed on a semiconductor wafer 1 a in a wafer process apparatusincluding a diffusion device, a photo-etching device, an epitaxialdevice and so 25 forth. As shown in FIG. 4, each of the semiconductordevices 1 b has a group of electrodes 1 c of Al or Cu, each of which hasa length of 10-200)μm and a thickness of about 1 μm. The electrodes 1 care surrounded by a protect layer 1 b 1 of synthetic resin with athickness of about 1-10 μm. The protect layer 1 b 1 may be preventedfrom extending to an outer peripheral edge of the semiconductor device 1b to form a non-protect-layer bare chip area 1 b 2 with a width of about10-300 μm between the outer peripheral edge and the protect layer 1 b 1,after the semiconductor devices 1 a are cut out from the wafer. Thenon-protect-layer bare chip area 1 b 2 may be arranged at another areaor various areas other than an outer peripheral area of thesemiconductor device 1 b.

[0061] (2) Pre-Inspection by Probe

[0062] Each of the semiconductor devices 1 b on the wafer is inspectedby contacting a probe of a pre-inspection device with each of theelectrodes 1 c.

[0063] (3) Dicing the Wafer to Form Semiconductor Devices

[0064] The wafer is cut off by a dicer or the like to be divided to thesemiconductor devices 1 b, as shown in FIG. 4.

[0065] (4) Mounting the Semiconductor Device into a Packaging 20 Device

[0066] The semiconductor devices 1 b of a predetermined number not lessthan two and less than the number of the semiconductor devices 1 bformed on the wafer are mounted onto a packaging device.

[0067] As shown in FIG. 5, the packaging device includes a base 3, acontact member 5 as the claimed first sheet, a positioning tray 4 as theclaimed second sheet, a tray cover 4 b as the claimed third sheet,elastic members 9 and a closure cover 9.

[0068] The base 3 and the closure cover 9 are made of thermosettingresin, aluminum, stainless steel or ceramic, and are machined afterbeing molded. The base 3 and the closure cover 9 reinforce the contactmember 5 and the positioning tray 4 to keep their shape constant againsta force applied to the packaging device. The closure cover 9 isswingably supported on the base 3 through hinges 3 a.

[0069] The positioning tray 4 has holes 4 a at a distance from eachother. The positioning tray 4 may be divided to a plurality ofpositioning tray elements, as shown in FIG. 5. A main component of thepositioning tray 4 is preferably equal to that (for example, Si) of thesemiconductor devices 1 b in order to decrease the difference in thecoefficient of thermal expansion between the positioning tray 4 and thesemiconductor devices 1 b. A metallic material or ceramic (for example,aluminum-nitride) whose coefficient of thermal expansion is similar tothe coefficient of thermal expansion of the semiconductor devices 1 bmay be used as a material in the positioning tray 4. The semiconductordevices 1 b are accurately positioned in the holes 4 a in bothdirections perpendicular to each other and perpendicular to a thicknessdirection of the semiconductor devices 1 b.

[0070] As shown in FIGS. 6 and 7a, a surface of the contact member 5facing the semiconductor devices 1 b includes ends 5 a of electricallyconductive members 5 b, to be contacted respectively with the electrodes1 c. As shown in FIG. 7b, another or reverse the surface of the contactmember 5 arranged on an exterior of the packaging device includes ends 5c of the electrically conductive members 5 b, to be contactedrespectively with a probe of an inspection device. The electricallyconductive members 5 b extend through or over the contact member 5 fromthe ends 5 a to the ends 5 c.

[0071] A main component of the contact member 5 is preferably equal tothat (for example, Si) of the semiconductor devices 1 b in order todecrease the difference in the coefficient of thermal expansion betweenthe contact member 5 and the semiconductor devices 1 b. A metallicmaterial or ceramic (for example, aluminum-nitride) whose coefficient ofthermal expansion is similar to the coefficient of thermal expansion ofthe semiconductor devices 1 b may be used as a material in the contactmember 5. The contact member 5 may be made of glass-epoxy, ceramic, ororganic material such as polyimide.

[0072] The elastic members 8 press, respectively, the semiconductordevices 1 b against the contact member 5, and are made of an elastomersuch as silicone-rubber. The elastic members 8 may be springs such ascoil-springs.

[0073] The tray cover 4 b is made of thermo-setting resin, aluminum,stainless steel, or ceramic as similar to the base 3 and the closurecover 9, and are machined after being molded. The tray cover 4 bprotects the positioning tray 4 and the contact member 5 against thesemiconductor devices 1 b to be inserted in the holes 4 a orcontaminant.

[0074] The closure cover 9 completely covers the semiconductor devices 1b as seen in the thickness direction of the semiconductor devices 1 b.

[0075] The ends 5 c of the electrically conductive members 5 b exposedto the exterior of the packaging device are more widely distributed overanother surface or the reverse surface of the packaging device incomparison with an arrangement of the electrodes 1 c on thesemiconductor devices 1 b. An exposed area of each of the ends 5 c issignificantly larger than an exposed area of each of the electrodes 1 cand an exposed area of each of the ends 5 a on the surface of thecontact member 5 facing to the semiconductor devices 1 b, as seen in thethickness direction of the semiconductor devices 1 b, so that acapacitance between each of the electrodes 1 c and each of the ends 5 ais kept small while the exposed area of each of the ends 5 c issufficiently large for being easily and securely connected with a probeof an inspection device. The distance between central positions of theends 5 c is preferably about 0.5-1.5 mm, and the area of the ends 5 c asseen in the semiconductor thickness direction is preferably about 0.1-1mm².

[0076] (5) Burn-In Treatment

[0077] The packaging device containing the semiconductor devices 1 b isheated to keep the temperature of the semiconductor devices 1 b at100-150° C. for a predetermined time period while an electric stress(voltage) is applied to each of the semiconductor devices 1 b throughthe electrode 1 c and the electrically conductive member 5 b, so thatany occurrence of problems in any of the semiconductor devices 1 b isaccelerated.

[0078] (5-1) Mounting the Packaging Device Onto a Burn-In Device

[0079] The packaging device is put into a socket 10 on an printed plate6, through which the electric stress (voltage) is applied to each of thesemiconductor devices 1 b in the packaging device during the burn-intreatment, as shown in FIG. 10a. The packaging device is compressed intothe socket 10 by a cover to keep the electrical communication betweenthe electrically conductive members 5 b and the printed plate 6, asshown in FIG. 10b. As shown in FIG. 11, contact probes 6 a extendingfrom the printed plate 6 contact respectively with the ends 5 c of theelectrically conductive members 5 b to energize the semiconductordevices 1 b during the burn-in treatment. The contact probes 6 a of bentmetallic plate as shown in FIG. 12, may be replaced by land areasconnecting with the ends 5 c or coil-spring-supported bars, as shown inFIG. 13.

[0080] As shown in FIG. 13, a support surface of the contact member 5,on which the ends 5 a of the electrically conductive members 5 b arearranged, has spacer projections 5 d between which each of the ends 5 ais arranged (a pair of the spacer projections and each of the ends 5 abetween the spacer projections 5 d of the pair are aligned along asubstantially straight imaginary line on the support surface). Thespacer projections 5 d and the ends 5 a contact with the semiconductordevices 1 b to form securely a space between the contact member 5 andthe semiconductor devices 1 b at a region of the support surface betweenthe each of the ends 5 a and each of the spacer projections 5 d of thepair along the substantially straight imaginary line. The spacerprojections 5 d preferably contact with the non-protect-layer bare chiparea 1 b 2.

[0081] By virtue of the space provided between the contact member 5 andthe semiconductor devices 1 b at the region of the support surfacebetween each of the ends 5 a and each of the spacer projections 5 d ofthe pair along the substantially straight imaginary line, the followingadvantages are achieved:

[0082] an easily breakable, important area of the semiconductor device 1b, including thereon an electric circuit under and around the electrodes1 c (corresponding to substantially an area of the protect layer 1 b 1is prevented from being compressed by the contact member 5, and anunimportant area of the semiconductor device 1 b is compressed by thecontact member 5 to hold the semiconductor device 1 b,

[0083] a capacitance between the contact member 5 and the semiconductordevice 1 b is decreased to improve the responding characteristic of thesemiconductor device 1 b relative to a high-frequency input signal,

[0084] the easily breakable, important area of the semiconductor device1 b is prevented from being pressed and being damaged by a contaminantbetween the contact member and the semiconductor device 1 b, and

[0085] an attitude of the ends 5 a to be freely changeable in accordancewith a shape of the electrode 1 c is prevented from being undesirablyand strongly fixed by a region of the support surface close to theelectrodes.

[0086] (5-2) Performing Burn-In Treatment

[0087] A thermal stress and the electric stress are applied to thesemiconductor devices 1 b for a long time period, so that any occurrenceof a problem in any of the semiconductor devices 1 b is accelerated.

[0088] (5-3) Taking Out the Packaging Device from the Burn-In Device

[0089] The packaging device is removed from the socket 10 after theburn-in treatment.

[0090] (6) Transferring the Packaging Device from the Burn-In Device toan Operation Inspection Device

[0091] (7) Operation Inspection

[0092] (7-1) Mounting the Packaging Device Onto the Operation InspectionDevice

[0093] The packaging device is put into a socket on an printed plate foroperation inspection

[0094] (7-2) Performing Operation Inspection

[0095] An operational characteristic of each of the semiconductordevices 1 b is inspected by energizing the semiconductor devices 1 b anddetecting output signals of the semiconductor devices 1 b through theelectrodes 1 c and the electrically conductive members 5 b, while thesemiconductor devices 1 b are heated to 25-75° C.

[0096] (7-3) Taking Out the Packaging Device from the OperationInspection Device

[0097] The packaging device is taken out from the socket.

[0098] (8) Taking Out the Semiconductor Device from the Packaging Device

[0099] The semiconductor devices 1 b are taken out from the packagingdevice to be used independent of each other.

What is claimed is:
 1. A method for producing semiconductor devices, comprising the steps of: forming electric circuits on a semiconductor wafer, cutting off the semiconductor wafer to be divided to the semiconductor devices respectively including the electric circuits so that the semiconductor devices are separated away from each other, mounting a plurality of the semiconductor devices onto a packaging device for keeping a positional relationship among the semiconductor devices and a positional relationship between the packaging device and each of the semiconductor devices constant with a spacing between the semiconductor devices on the packaging device, transferring the packaging device holding thereon the plurality of the semiconductor devices onto an inspection device so that each of the semiconductor devices on the packaging device is inspected on the inspection device, while the positional relationship among the semiconductor devices and the positional relationship between the packaging device and the each of the semiconductor devices are kept constant on the packaging device, and removing the semiconductor devices from the packaging device after the each of the semiconductor devices on the packaging device is inspected on the inspection device, so that the semiconductor devices are separated away from each other to be useable independent of each other.
 2. A method according to claim 1, wherein at least one of an inspection for judging whether or not the each of the semiconductor devices is useable after at least one of a predetermined temperature and a predetermined voltage is applied to the each of the semiconductor devices during a predetermined time period and an inspection for judging whether or not the each of the semiconductor devices performs a predetermined operating characteristic in a predetermined environment condition is carried out on the inspection device.
 3. A method according to claim 1, further comprising the step of selecting the semiconductor devices to be mounted onto the packaging device from the semiconductor devices formed on the semiconductor wafer on the basis of a relationship between an electrical input and an electrical output on each of the semiconductor devices.
 4. A method according to claim 3, wherein the selecting step is carried out after the semiconductor wafer is cut off to be divided to the semiconductor devices.
 5. A method according to claim 3, wherein the selecting step is carried out before the semiconductor wafer is cut off to be divided to the semiconductor devices.
 6. A method according to claim 1, wherein a number of the semiconductor devices held on the packaging device when the packaging device is transferred onto the inspection device is smaller than a number of the semiconductor devices formed on the semiconductor wafer.
 7. A method according to claim 1, wherein all of the semiconductor devices are pressed against the packaging device by an elastic member while the each of the semiconductor devices on the packaging device is inspected on the inspection device.
 8. A method according to claim 7, wherein a direction in which all of the semiconductor devices are pressed against the packaging device by the elastic member is opposite to a direction in which an electrically conductive member of the packaging device is pressed against an electrode of the each of the semiconductor devices on the packaging device, in a thickness direction of the semiconductor devices.
 9. A method according to claim 1, wherein the packaging device is pressed against the inspection device while the each of the semiconductor devices on the packaging device is inspected on the inspection device.
 10. A method according to claim 9, wherein a direction in which the packaging device is pressed against the inspection device is opposite to a direction in which an electrically conductive member of the packaging device is pressed against an electrode of the each of the semiconductor devices on the packaging device.
 11. A packaging device for holding thereon a plurality of semiconductor devices to be inspected on an inspection device including a probe to be electrically connected to an electrode of each of the semiconductor devices, comprising, holes for respectively receiving detachably therein the semiconductor devices to keep a positional relationship among the semiconductor devices and a positional relationship between the packaging device and each of the semiconductor devices constant with a spacing between the semiconductor devices, in a direction perpendicular to a thickness direction of the semiconductor devices, and electrically conductive members adapted to be connected respectively to the electrodes of the semiconductor devices, and extending to an exterior of the packaging device so that the probe is connected to each of the electrically conductive members.
 12. A packaging device according to claim 11, wherein a main component of a part of the packaging device surrounding the holes is equal to that of the semiconductor devices.
 13. A packaging device according to claim 11, further comprising an elastic member for pressing all of the semiconductor devices on the packaging device against the packaging device in the thickness direction of the semiconductor devices when the each of the semiconductor devices on the packaging device is inspected on the inspection device.
 14. A packaging device according to claim 13, wherein a direction in which all of the semiconductor devices are pressed against the packaging device by the elastic member is opposite to a direction in which the electrically conductive members are pressed against respectively the semiconductor devices, in the thickness direction of the semiconductor devices.
 15. A packaging device according to claim 11, wherein the probe and the each of the electrically conductive members are elastically connected to each other.
 16. A packaging device according to claim 11, wherein the packaging device includes a first sheet for supporting the semiconductor devices in the thickness direction of the semiconductor devices, and a second sheet having the holes, the first and second sheets are stacked in the thickness direction of the semiconductor devices, and the electrically conductive members extend through the first sheet in the thickness direction of the semiconductor devices.
 17. A packaging device according to claim 16, wherein a main component of the second sheet is equal to that of the semiconductor devices.
 18. A packaging device according to claim 16, further comprising a third sheet having through holes and covering the second sheet, wherein the first, second and third sheets are stacked in the thickness direction of the semiconductor devices while the through holes are aligned respectively with the holes in the thickness direction of the semiconductor devices, and opening areas of the through holes are larger than those of the holes to prevent the semiconductor devices from being positioned respectively by the through holes.
 19. A packaging device according to claim 11, further comprising a support part on which an end of the each of the electrically conductive members is arranged, wherein the support part has a pair of projections between which the end of the each of the electrically conductive members is arranged in the direction perpendicular to the thickness direction of the semiconductor devices, and the end of the each of the electrically conductive members and both of the projections are adapted to contact with the each of the semiconductor devices so that an area of the support part between the end of the each of the electrically conductive members and each of the projections is prevented from contacting with the each of the semiconductor devices.
 20. A packaging device according to claim 11, wherein a clearance is formed between each of the holes and each of the semiconductor devices in both directions perpendicular to each other and perpendicular to the thickness direction of the semiconductor device to prevent the each of the semiconductor devices from being compressed in the each of the holes in the both directions when the each of the semiconductor devices is inspected on the inspection device.
 21. A packaging device according to claim 11, wherein at least a part of the electrode of each of the semiconductor devices is covered by the packaging device to prevent the at least a part of the electrode of the each of the semiconductor devices from facing to an environment surrounding the packaging device in the thickness direction of the semiconductor devices.
 22. A packaging device according to claim 11, further comprising a support part on which an end of the each of the electrically conductive members is arranged, and a pair of slits between which the support part with the end is arranged in the direction perpendicular to the thickness direction of the semiconductor devices.
 23. A packaging device according to claim 11, wherein an exposed area of an end of the each of the electrically conductive members adapted to face to the each of the semiconductor devices is smaller than an exposed area of another end of the each of the electrically conductive members on the exterior of the packaging device, as seen in the thickness direction of the semiconductor devices. 